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Product description

C-Solder is the trade name for a group of new tin-based, lead-free low-temperature soldering alloys which enable the joining of various carbon materials, including carbon fibres or carbon nanotube fibres, in both carbon-carbon and carbon-metal combinations. The resultant bond is mechanically strong and electrically conductive.


  • Melting Point: 232 oC (solidus temperature)
  • Density: ~ 7.4 g/cm3
  • Excellent flow
  • Good wetting of surfaces to be joined
  • Electrically and Thermally Conductive
  • Aluminium to Aluminium can be soldered without using flux.
  • Carbon can be soldered to metals (e.g. Copper, Aluminium), Ceramics and Glass materials
  • C-Solder is not affected by cleaning solvents
  • C-Solder does not leave residues
  • C-Solder is not flammable
  • C-Solder is flux Free
  • C-Solder is lead Free


Chemical Composition

90 – 100% 0.01 – 1% 3 – 5% 2 – 6%

Main features of C-Solder compared to Brazing, Adhesive Bonding and Mechanical Fastening

FeatureBrazingAdhesive BondingMechanical FasteningSoldering(C-Solder)
Time to make the joint Minutes to hours Minutes to hours Rapid assembly Several seconds
Surface Preparation Minimal Extensive Minimal No surface cleaning
Thin Sections Yes Yes No Yes
Joint Weight Light Light Heavy Light
Stress Concentrations High thermal stresses Can be very low Significant Low
Sensitivity to Peel Forces Susceptible Susceptible Resistant Susceptible
Sensitivity to Tensile Forces Resistant Resistant Susceptible Resistant
Applied In-situ No Yes Yes Yes
Suitability for CNTs, Graphene & Carbon Components No Yes No Yes
Electrically & Thermally Conductive Yes No No Yes

How to apply

The soldering of carbon materials using C-Solder may be performed in air at temperatures in the range 235 – 450 °C with the use of a classic soldering iron, a soldering heat gun, or a torch.

The high temperatures associated with a brazing process (800 – 1200 °C) may lead to the combustion of carbon materials, in particular nanostructured ones, as well as creating stress concentration during cooling, particularly if the joint comprises materials with considerably different thermal expansion coefficients.

Thanks to its unique patented chemical composition, C-Solder alloys allow more control of the joining processes. Further, C-Solder alloys exhibit improved electrical and mechanical properties in relation to commercially available alloys.

Handling and Storage

Indefinite shelf life applies to solid C-Solder at room temperature.


Use of adequate ventilation and extraction, and proper personal protective equipment are necessary. Please refer to the Safety Data Sheet for any specific emergency information. Hazardous waste needs to be treated, disposed or recycled, safely according to the Hazardous Waste legislation and regulations.

Properties shown are typical values, they are not absolute material properties, and should be used for guidance only. It is recommended that materials and components are tested for their suitability for a specific application.

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